2 (5)

DA1178.006

13 July, 2006

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

VDD

182

1317

Serial Bus Clock Input

CLK

645

1329

Serial Bus Data Input

DA

418

1329

Programming Input

PV

876

1311

Voltage Control Input

VC

215

213

Crystal Oscillator Output

X2

1053

209

Crystal/Varactor Oscillator Input

X1

434

209

Power Supply Ground

VSS

617

2267

Buffer Output

OUT

1218

1329

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Min

Max

Unit

Note

Supply Voltage

-0.3

6.0

V

Input Voltage

V

1)

Power Dissipation

100

mW

Operating Temperature

-35

85

Storage Temperature

-55

150

Note 1: Not valid for programming pin PV

RECOMMENDED OPERATION CONDITIONS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Supply Voltage

2.7

2.8

5.5

V

Supply Current

Vdd = 2.8 Volt

2.3

mA

Operable Temperature

-30

+85

Storage Temperature

Relative humidity =

15%…70%

-5

+40