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PACKAGE OUTLINE

C

16X

0.30

0.18

1.68 0.07

16X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

12X 0.5

4X

1.5

A

3.1

2.9

B

3.1

2.9

VQFN - 1 mm max height

RGT0016C

PLASTIC QUAD FLATPACK - NO LEAD

4222419/B 11/2016

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

4

9

12

5

8

16

13

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.600

LOG200

SBOSA28 – AUGUST 2023

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