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AS5116

Absolute Maximum Ratings

Datasheet

• PUBLIC

DS000686

• v4-00 • 2022-Feb-18

34

│ 7

4

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. These are stress ratings only. Functional operation of the device at these or any other

conditi

ons beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Figure 5:

Absolute Maximum Ratings of AS5116

Symbol

Parameter

Min

Max

Unit

Comments

Electrical Parameters

VDD5

DC Voltage at VDD5 pin

-0.3

7

V

VREG

DC Voltage at VDD3 pin

-0.3

5

V

VSS

DC Voltage at VSS pin

-0.3

0.3

V

VIN

Input Pin Voltage to Ground

-0.3

VDD5 +

0.3

V

ISCR

Input Current (latch-up immunity)

± 100

mA

AEC-Q100-004

Continuous Power Dissipation

PT

Total Power Dissipation

150

mW

Electrostatic Discharge

ESDHBM

Electrostatic Discharge HBM

± 2000

V

AEC-Q100-002

ESDCDM

Electrostatic Discharge CDM

± 500

V

AEC-Q100-011

Temperature Ranges and Storage Conditions

TA

Operating Ambient Temperature

-40

150

°C

TJ

Operating Junction Temperature

165

°C

TA_PROG

Ambient Temperature during OTP

Programming

0

45

°C

TSTRG

Storage Temperature Range

- 55

150

°C

TBODY

Package Body Temperature

260

°C

IPC/JEDEC J-STD-020 (1)

RHNC

Relative Humidity (non-condensing)

5

85

%

MSL

Moisture Sensitivity Level

3

Represents a maximum

floor lifetime of 168 h

Temperature Soldering

TPEAK

Peak Temperature

260

°C

IPC/JEDEC J-STD-020

tWELL

Well Time above 217 °C

30

45

s

(1)

The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.” The lead finish for

Pb-

free leaded packages is “Matte Tin” (100 % Sn)