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SST25VF080B Scheda tecnica(PDF) 28 Page - Microchip Technology |
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SST25VF080B Scheda tecnica(HTML) 28 Page - Microchip Technology |
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28 / 33 page ![]() 2005-2020 Microchip Technology Inc. DS20005045D-page 28 SST25VF080B 2-IN 1-IN 0.65 BSC BOTTOM VIEW A1 CORNER TOP VIEW 16-xfbga-ZC Z1 C-25VF080B-018 1mm SIDE VIEW SEATING PLANE 0.10 0 .015 0.40 max 0.35 nom 0.30 min 0.05 BA 2-OUT 1-OUT 2-IN 1-IN 2-OUT 1-OUT D C B A INNER SECTION VIEW INNER SECTION DETAIL ø0.25 0. 03 (16X) Note: 1. This specific package is not registered in JEDEC Publication 95. 2. All linear dimensions are in millimeters. 3. recommends underfill for best solder joint reliability. 4. Top View body tolerance is 0.05 mm. 5. Coplanarity is 0.05 mm. 6. Ball width at interface to package body is 0.25 mm ( 0. 03 mm). 0.50 BSC 0.50 2.0 BSC BSC A1 INDICATOR (engraved) C D For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: |
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