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BUT11AI Scheda tecnica(PDF) 1 Page - NXP Semiconductors

Il numero della parte BUT11AI
Spiegazioni elettronici  Silicon Diffused Power Transistor
PDF  4 Pages
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Produttore elettronici  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUT11AI Scheda tecnica(HTML) 1 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUT11AI
GENERAL DESCRIPTION
Enhanced performance, high speed switching npn transistor in TO220AB envelope specially suited for high
frequency electronic lighting ballast applications and converters, inverters, switching regulators, motor control
systems etc.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE = 0 V
-
1000
V
V
CEO
Collector-emitter voltage (open base)
-
450
V
I
C
Collector current (DC)
-
5
A
I
CM
Collector current peak value
-
10
A
P
tot
Total power dissipation
T
mb ≤ 25 ˚C
-
100
W
V
CEsat
Collector-emitter saturation voltage
I
C = 2.5 A; IB = 0.33 A
-
1.5
V
I
Csat
Collector Saturation current
2.5
A
t
f
Inductive fall time
I
Con = 2.5 A; IBon = 0.5 A
0.08
0.15
µs
PINNING - TO220AB
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
base
2
collector
3
emitter
tab
collector
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE = 0 V
-
1000
V
V
CEO
Collector-emitter voltage (open base)
-
450
V
I
C
Collector current (DC)
-
5
A
I
CM
Collector current peak value
-
10
A
I
B
Base current (DC)
-
2
A
I
BM
Base current peak value
-
4
A
P
tot
Total power dissipation
T
mb
25 ˚C
-
100
W
T
stg
Storage temperature
-65
150
˚C
T
j
Junction temperature
-
150
˚C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
R
th j-mb
Junction to mounting base
-
1.25
K/W
R
th j-a
Junction to ambient
in free air
-
60
K/W
12 3
tab
b
c
e
August 1997
1
Rev 1.000


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