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BUT11AX Scheda tecnica(PDF) 4 Page - NXP Semiconductors |
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BUT11AX Scheda tecnica(HTML) 4 Page - NXP Semiconductors |
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4 / 8 page ![]() Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AX Fig.7. Normalised power derating and second breakdown curves. Fig.8. Reverse bias safe operating area. T j ≤ Tj max Fig.9. Typical DC current gain. h FE = f(IC); parameter VCE Fig.10. Forward bias safe operating area. T hs ≤ 25 ˚C (1) P tot max and Ptot peak max lines. (2) Second breakdown limits. I Region of permissible DC operation. II Extension for repetitive pulse operation. III Extension during turn-on in single transistor converters provided that R BE ≤ 100 Ω and tp ≤ 0.6 µs. NB: Mounted with heatsink compound and 30 ± 5 newton force on the centre of the envelope. 0 20 40 60 80 100 120 140 Ths / C % Normalised Derating 120 110 100 90 80 70 60 50 40 30 20 10 0 with heatsink compound P tot 1 10 100 1000 100 10 1 0.1 0.01 tp = 10 us 100 us 1 ms 10 ms DC IC / A V / V ICM max IC max II I = 0.01 III 500 ms (1) (2) CE 6 5 4 3 2 1 0 0 400 800 1200 IC / A BUT11AX VCE / V 0.01 0.1 1 10 100 IC / A h BUT11AX 100 10 1 FE 1V 5V November 1995 4 Rev 1.100 |
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