ADCMP552 datasheet(14/16 Pages) AD

14 / 16 page

ADCMP551/ADCMP552/ADCMP553

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

PIN 1

8°

0°

0.236

BSC

0.154

BSC

0.010

0.004

0.012

0.008

0.025

BSC

COPLANARITY

0.004

0.065

0.049

0.069

0.053

SEATING

PLANE

0.010

0.006

0.050

0.016

0.341

BSC

COMPLIANT TO JEDEC STANDARDS MO-137AD

Figure 25. 20-Lead Shrink Small Outline Package [QSOP]

(RQ-20)

Dimensions shown in inches

PIN 1

SEATING

PLANE

0.010

0.004

0.012

0.008

0.025

BSC

0.010

0.006

0.050

0.016

8°

0°

COPLANARITY

0.004

0.065

0.049

0.069

0.053

0.154

BSC

0.236

BSC

COMPLIANT TO JEDEC STANDARDS MO-137AB

0.193

BSC

Figure 26. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in inches

0.80

0.60

0.40

8°

0°

4.90

BSC

PIN 1

0.65 BSC

3.00

BSC

SEATING

PLANE

0.15

0.00

0.38

0.22

1.10 MAX

3.00

BSC

COPLANARITY

0.10

0.23

0.08

COMPLIANT TO JEDEC STANDARDS MO-187AA

Figure 27. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADCMP551BRQ

−40°C to +85°C

16-Lead QSOP

RQ-16

ADCMP552BRQ

−40°C to +85°C

20-Lead QSOP

RQ-20

ADCMP553BRM

−40°C to +85°C

8-Lead MSOP

RM-8

B53

EVAL-ADCMP551BRQ

EVALUATION BOARD

EVAL-ADCMP552BRQ

EVALUATION BOARD

ADCMP552 Scheda tecnica(PDF) 14 Page - Analog Devices

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