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AD8091ART-R2 Scheda tecnica(PDF) 8 Page - Analog Devices

Il numero della parte AD8091ART-R2
Spiegazioni elettronici  Low Cost, High Speed Rail-to-Rail Amplifiers
PDF  20 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

AD8091ART-R2 Scheda tecnica(HTML) 8 Page - Analog Devices

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A8091/AD8092
Rev. B | Page 8 of 20
Airflow increases heat dissipation, effectively reducing θJA. Also,
more metal directly in contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA. Care must be taken to minimize parasitic capacitances
at the input leads of high speed op amps as discussed in the
board layout section.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the SOIC-8
(125°C/W), SOT23-5 (180°C/W), and MSOP-8 (150°C/W) on a
JEDEC standard four-layer board.
2.0
0
0.5
1.0
1.5
–40 –30 –20 –10
0
102030
405060
708090
AMBIENT TEMPERATURE (
°C)
TJ = 150°C
MSOP-8
SOIC-8
SOT23-5
Figure 4. Maximum Power Dissipation vs.
Temperature for a Four-Layer Board



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