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SY10E175JC Scheda tecnica(PDF) 3 Page - Micrel Semiconductor

Il numero della parte SY10E175JC
Spiegazioni elettronici  9-BIT LATCH WITH PARITY
PDF  4 Pages
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Produttore elettronici  MICREL [Micrel Semiconductor]
Homepage  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

SY10E175JC Scheda tecnica(HTML) 3 Page - Micrel Semiconductor

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SY10E175
SY100E175
Micrel, Inc.
M9999-032006
hbwhelp@micrel.com or (408) 955-1690
Note:
1. Within-device skew is defined as identical transitions on similar paths
through a device.
TRUTH TABLE
D
LEN
MR
Q
ODDPAR
H
L
L
H
H if odd no. of Dn HIGH
LLLL
H if odd no. of Dn HIGH
XH
L
Q0
Q0
XX
H
L
L
TA = 0
°CTA = +25°CTA = +85°C
Symbol
Parameter
Min.
Typ.
Max.
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
Condition
tPD
Propagation Delay to Output
ps
D to Q
450
600
800
450
600
800
450
600
800
D to ODDPAR
850
1150
1450
850
1150
1450
850
1150
1450
LEN to Q
525
700
900
525
700
900
525
700
900
LEN to ODDPAR
525
700
900
525
700
900
525
700
900
MR to Q (tPHL)
525
700
900
525
700
900
525
700
900
MR to ODDPAR (tPHL)
525
700
900
525
700
900
525
700
900
tS
Set-up Time
ps
D (Q)
275
100
275
——
275
——
D (ODDPAR)
900
700
900
——
900
——
tH
Hold Time
ps
D (Q)
175
–100
175
——
175
——
D (ODDPAR)
–300
–700
—–300
——
–300
——
tRR
Reset Recovery Time
850
600
850
600
850
600
ps
tskew
Within-Device Skew
ps
1
LEN, MR
75
——
75
——
75
D to Q
75
——
75
——
75
D to ODDPAR
200
——
200
——
200
tr
Rise/Fall Times
300
500
800
300
500
800
300
500
800
ps
tf
20–80%
AC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = 0
°CTA = +25°CTA = +85°C
Symbol
Parameter
Min.
Typ.
Max.
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
Condition
IIH
Input HIGH Current
——
150
——
150
——
150
µA
IEE
Power Supply Current
mA
10E
110
132
110
132
110
132
100E
110
132
110
132
127
152
DC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND



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