USB 2.0 ATA/ATAPI Controller

Datasheet

SMSC USB97C202

Page 19

Revision 1.6 (01-09-07)

DATASHEET

Chapter 9

Package Outline

Figure 9.1 - 100-Pin STQFP Package Outline, 12x12x1.4 Body, 2MM Footprint (Rev A)

Table 9.1 - 100-Pin STQFP Package Parameters (Rev A)

MIN

NOMINAL

MAX

REMARKS

A

~

~

1.60

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

1.35

~

1.45

Body Thickness

D

13.80

~

14.20

X Span

D1

11.80

~

12.20

X body Size

E

13.80

~

14.20

Y Span

E1

11.80

~

12.20

Y body Size

H

0.09

~

0.20

Lead Frame Thickness

L

0.45

0.60

0.75

Lead Foot Length

L1

~

1.00

~

Lead Length

e

0.40 Basic

Lead Pitch

θ

0

o

~

7

o

Lead Foot Angle

W

0.13

0.16

0.23

Lead Width

R1

0.08

~

~

Lead Shoulder Radius

R2

0.08

~

0.20

Lead Foot Radius

ccc

~

~

0.08

Coplanarity

Notes:

1.

Controlling Unit: millimeter.

2.

Tolerance on the true position of the leads is ± 0.035 mm maximum.

3.

Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm.

4.

Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.

Details of pin 1 identifier are optional but must be located within the zone indicated.