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AM29F010B50DWI1 Scheda tecnica(PDF) 6 Page - Advanced Micro Devices |
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AM29F010B50DWI1 Scheda tecnica(HTML) 6 Page - Advanced Micro Devices |
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6 / 14 page ![]() 4 Am29F010B Known Good Die SU PP L E ME NT PAD DESCRIPTION Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment. Pad Signal Pad Center (mils) Pad Center (millimeters) X YXY 1VCC 0.00 0.00 0.00 0.00 2 A16 –6.78 0.00 –0.17 0.00 3 A15 –12.20 0.00 –0.31 0.00 4 A12 –18.03 0.00 –0.46 0.00 5 A7 –23.46 0.00 –0.60 0.00 6 A6 –29.29 0.00 –0.74 0.00 7 A5 –34.72 0.00 –0.88 0.00 8 A4 –41.75 –5.01 –1.06 –0.13 9 A3 –41.14 –116.93 –1.04 –2.97 10 A2 –41.30 –134.13 –1.05 –3.41 11 A1 –35.88 –134.13 –0.91 –3.41 12 A0 –30.04 –134.13 –0.76 –3.41 13 D0 –23.81 –133.31 –0.60 –3.39 14 D1 –17.89 –133.31 –0.45 –3.39 15 D2 –12.06 –133.31 –0.31 –3.39 16 VSS –6.40 –133.31 –0.16 –3.39 17 D3 –0.59 –133.31 –0.01 –3.39 18 D4 5.25 –133.31 0.13 –3.39 19 D5 11.16 –133.31 0.28 –3.39 20 D6 17.00 –133.31 0.43 –3.39 21 D7 22.92 –133.31 0.58 –3.39 22 CE# 29.09 –134.37 0.74 –3.41 23 A10 35.02 –134.13 0.89 –3.41 24 OE# 34.68 –116.93 0.88 –2.97 25 A11 35.45 –5.01 0.90 –0.13 26 A9 29.27 –0.25 0.74 –0.01 27 A8 23.34 0.00 0.59 0.00 28 A13 17.92 0.00 0.46 0.00 29 A14 12.08 0.00 0.31 0.00 30 WE# 6.66 0.00 0.17 0.00 |
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