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SDA006 Scheda tecnica(PDF) 1 Page - Diodes Incorporated |
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SDA006 Scheda tecnica(HTML) 1 Page - Diodes Incorporated |
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1 / 4 page ![]() Lead-free Green DS30559 Rev. 3 - 2 1 of 4 SDA006 www.diodes.com ã Diodes Incorporated SDA006 DATA BUS TRANSIENT SUPPRESSOR/3-PHASE FULL WAVE BRIDGE RECTIFIER · Case: SOT-363 · Case Material: Molded Plastic, "Green" Molding Compound . UL Flammability Classification Rating 94V-0 (Note 4) · Moisture Sensitivity: Level 1 per J-STD-020C · Terminals: Finish ¾ Matte Tin annealed over Alloy 42 Leadframe. Solderable per MIL-STD-202, Method 208 · Ordering Information, See Page 3 · Marking: JAC (See Page 3) · Weight: 0.006 grams (approximate) Mechanical Data A M J L D B C H K G F TOP VIEW DC V + CC DC V + CC AC DL 3 3 / / / / / / DL AC 1 1 DL AC 2 2 GND DC- Features SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal E 0.30 0.40 G 1.80 2.20 H 1.80 2.20 J ¾ 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.25 a 0 ° 8 ° All Dimensions in mm · Fast Switching Speed · Ultra-Small Surface Mount Package · For 3-Phase Full Wave Bridge Rectification, or 3 Dataline Rail Clamp · Lead Free By Design/RoHS Compliant (Note 3) · "Green" Device (Note 4) Characteristic Symbol Value Unit Non-Repetitive Peak Reverse Voltage VRM 100 V Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 75 V RMS Reverse Voltage VR(RMS) 53 V Forward Continuous Current (Note 1) IFM 215 mA Non-Repetitive Peak Forward Surge Current @ t = 1.0 ms @ t = 1.0ms @ t = 1.0s IFSM 2.0 1.0 0.5 A Clamping Voltage (Note 6) @ Ipp = 14.5A 8x20 ms Waveform VC 16 V Power Dissipation (Note 1) Pd 200 mW Thermal Resistance Junction to Ambient Air (Note 1) RqJA 625 °C/W Power Dissipation (Note 2) Pd 300 mW Thermal Resistance Junction to Ambient Air (Note 2) RqJA 417 °C/W Operating and Storage Temperature Range Tj ,TSTG -65 to +150 °C Maximum Ratings @ TA = 25°C unless otherwise specified IEC Compatibility · 61000-4-2 (ESD) Air-10kV Contact-8kV · 61000-4-5 (Surge) 8x20 ms, 14.5 Amperes (Note 5) Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Tested with VCC connected to Ground to simulate appropriate VCC decoupling to Ground. 6. Reference to VCC or Ground. SPICE MODEL: SDA006 |
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