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L6701 Scheda tecnica(PDF) 42 Page - STMicroelectronics |
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L6701 Scheda tecnica(HTML) 42 Page - STMicroelectronics |
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42 / 44 page ![]() 17 Package Mechanical Data L6701 42/44 PowerSSO-36 Mechanical Data Dim. mm inch Min. Typ. Max. Min. Typ. Max. A 2.15 2.47 0.084 0.097 A2 2.15 2.40 0.084 0.094 a1 0 0.075 0 0.003 b 0.18 0.36 0.007 0.014 c 0.23 0.32 0.009 0.012 D (1) 1. “D and E” do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.15mm (0.006”) 10.10 10.50 0.398 0.413 E(2) 2. No intrusion allowed inwards the leads. 3. Flash or bleeds on exposed die pad shall not exceed 0.4 mm per side 7.4 7.6 0.291 0.299 e 0.50 0.020 e3 8.50 0.035 F 2.3 0.090 G 0.10 0.004 G1 0.06 0.002 H 10.10 10.50 0.398 0.413 h 0.40 0.016 L 0.55 0.85 0.022 0.033 M 4.3 0.169 N 10° (max) O 1.2 0.047 Q 0.8 0.031 S 2.9 0.114 T 3.65 0.144 U 1.0 0.039 X 4.10 4.70 0.161 0.185 Y 6.50 7.10 0.256 0.279 Figure 21. Package Dimensions |
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