9. Pad Layouts

Solder Reflow and Rework Recommendations

The dimension in the table below provide the recommended pad layout for each FSMD1210 device

Profile Feature

Pb-Free Assembly

Average Ramp -Up Rate (Tsmax to Tp) 3 /second max.

Preheat :

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

150

200

60-180 seconds

Time maintained above:

Temperature (TL)

Time (tL)

217

60-150 seconds

Peak/Classification Temperature (Tp) : 260

Time within 5

of actual Peak:

Temperature (tp)

20-40 seconds

Ramp-Down Rate :

6 /second max.

Time 25

to Peak Temperature:

8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.

Reflow Profile

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

All 1210 Series

2.00

1.00

2.80

Solder reflow

Due to “Lead Free” nature, Temperature and

Dwelling time for the soldering zone is higher

than those for Regular. This may cause

damage to other components.

1. Recommended max past thickness > 0.25mm.

2. Devices can be cleaned using standard

methods and aqueous solvent.

3. Rework use standard industry practices.

4. Storage Environment: < 30

/ 60%RH.

Caution:

1. If

reflow

temperatures

exceed

the

recommended profile, devices may not meet

the performance requirements.

2. Devices are not designed to be wave soldered

to the bottom side of the board.

NO.

PQ19-01ER

Surface Mount PPTC Resettable Fuse:

FSMD1210 Series

DEC-19-2023

Page 4 of 6

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Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.