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P82C150AHT Scheda tecnica(PDF) 32 Page - NXP Semiconductors |
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P82C150AHT Scheda tecnica(HTML) 32 Page - NXP Semiconductors |
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32 / 36 page ![]() 1996 Jun 19 32 Philips Semiconductors Preliminary specification CAN Serial Linked I/O device (SLIO) with digital and analog port functions P82C150 12 PACKAGE OUTLINE UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT136-1 91-08-13 95-01-24 X 14 28 w M θ A A1 A2 b p D HE L p Q detail X E Z c L v M A e 15 1 (A ) 3 A y 0.25 075E06 MS-013AE pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.42 0.39 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 |
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