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SS19 Scheda tecnica(PDF) 1 Page - Honeywell Solid State Electronics Center

Il numero della parte SS19
Spiegazioni elettronici  SS49/SS19 Series Analog Position Sensors
PDF  4 Pages
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Produttore elettronici  HONEYWELL [Honeywell Solid State Electronics Center]
Homepage  http://honeywell.com/Pages/Home.aspx
Logo HONEYWELL - Honeywell Solid State Electronics Center

SS19 Scheda tecnica(HTML) 1 Page - Honeywell Solid State Electronics Center

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Installation Instructions for the
ISSUE 2
SS49/SS19 Series Analog Position Sensors
PK 88740
MICRO SWITCH Sensing and Control
PERSONAL INJURY
• DO NOT USE these products as safety or
emergency stop devices, or in any other
application where failure of the product could
result in personal injury.
Failure to comply with these instructions could
result in death or serious injury.
SS49/SS19 ELECTRICAL CHARACTERISTICS
Supply Voltage
4 to 10 VDC
Supply Current
4 mA typ.
Output Type
Analog Sourcing
Output Voltage @ 0
Gauss, 25
°C
1.75 to 2.25 V @ 5 V
Sensitivity (measured
between -400 and +400
gauss), mV/G
Min.
0.60
Typ.
0.90
Max.
1.25
Operating Temperature
-40 to +100
°C (-40 to 212°F)
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (Vs)
± 12 VDC
Output Current
20 mA
Storage Temperature
-55 to +150
°C (-67 to
+302
°F)
Magnetic Flux
No limit. Circuit cannot be
damaged by magnetic
overdrive.
Absolute maximum ratings are the extreme limits
the device will withstand without damage to the
device. However, the electrical and mechanical
characteristics are not guaranteed as the maximum
limits (above recommended operating conditions)
are approached, nor will the device necessarily
operate at absolute maximum ratings.
SOLDERING/ASSEMBLY
SS49
Support leads during any forming/shearing
operation. Do not stress leads inside plastic case.
Hand soldering - Use 60/40 rosin core solder,
and a 399
°C (750°F) controlled temperature, 1/8”
chisel tip soldering iron. Do not hold iron on
terminals for more than four seconds. Lead
temperature at package must not exceed 250
°C
(482
°F).
Wave soldering - Use Loncoflux 106A35 or
equivalent. Set preheaters at 95
°C (200°F) for top
(component side) of PC board just prior to entering
wave. (This may be adjusted depending upon
board thickness.) Set solder temperature at 252
°C
to 260
°C max. (485°F to 500°F). Set conveyor
speed to about 4.5 feet per minute (1,37
meter/min.), choosing a speed which gives full
solder fillets and minimum bridging and icicles.
Provide rigid support for the board.
SS19/SS19T
MICRO SWITCH recommends an infrared reflow
process with peak temperatures not to exceed 190 -
200
°C (374 - 392°F) for 10 seconds maximum.
Keep exposure to high temperatures minimal.
CLEANING
Clean appropriately in accordance with applicable
safety procedures. MICRO SWITCH recommends
manual cleaning.
BLOCK DIAGRAM
TRANSFER CHARACTERISTICS


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