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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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BAS40 Scheda tecnica(PDF) 14 Page - NXP Semiconductors |
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BAS40 Scheda tecnica(HTML) 14 Page - NXP Semiconductors |
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14 / 21 page  BAS40_1PSXXSB4X_SER_7 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 07 — 12 May 2006 14 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste MBL872 1.30 0.30 R = 0.05 (8 ×) R = 0.05 (8 ×) 0.60 (2 ×) 0.70 (2 ×) 0.80 (2 ×) solder lands solder resist occupied area solder paste 0.90 0.30 (2 ×) 0.40 (2 ×) 0.50 (2 ×) |
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