AS7211 datasheet(30/37 Pages) OSRAM

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ams Datasheet

Page 29

[v1-00] 2016-Dec-23

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AS7211 − Soldering, Manufacturing Process Considerations & Storage Information

Manufacturing Process Considerations

The AS7211 package is compatible with standard reflow

no-clean and cleaning processes including aqueous, solvent or

ultrasonic techniques. However, as an open-aperture device,

precautions must be taken to avoid particulate or solvent

contamination as a result of any manufacturing processes,

including pick and place, reflow, cleaning, integration assembly

and/or testing. Temporary covering of the aperture is allowed.

To avoid degradation of accuracy or performance in the end

product, care should be taken that any temporary covering and

associated sealants/debris are thoroughly removed prior to any

optical testing or final packaging.

Storage Information

Moisture Sensitivity Optical characteristics of the device can be

adversely affected during the soldering process by the release

and vaporization of moisture that has been previously

absorbed into the package. To ensure the package contains the

smallest amount of absorbed moisture possible, each device is

baked prior to being dry packed for shipping. Devices are dry

packed in a sealed aluminized envelope called a

moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 12 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 12 months

• Ambient Temperature: <40°C

• Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed

the 12 month shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

AS7211 Scheda tecnica(PDF) 30 Page - OSRAM GmbH