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AS7221 Scheda tecnica(PDF) 10 Page - OSRAM GmbH

Il numero della parte AS7221
Spiegazioni elettronici  CCT Tuning Smart Lighting Manager
PDF  56 Pages
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Produttore elettronici  OSRAM [OSRAM GmbH]
Homepage  http://www.osram.com
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AS7221 Scheda tecnica(HTML) 10 Page - OSRAM GmbH

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AS7221
Absolute Maximum Ratings
Datasheet
• PUBLIC
DS000479
• v4-00 • 2019-Jun-28
55
│ 9
4
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only. Functional operation of the device at these or any other
conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. The device is not
designed for high-energy UV (ultraviolet) environments, including upward looking outdoor applications,
which could affect long-term optical performance. All voltages with respect to GND. Device
parameters are guaranteed at VDD = 3.3 V and TAMB = 25 °C unless otherwise noted.
Figure 5
Absolute Maximum Ratings of AS7221
Symbol
Parameter
Min
Typ
Max
Unit
Comments
Electrical Parameters
VDD_MAX
Supply Voltage VDD
-0.3
5
V
Pin VDD to GND,
Low Voltage pin
VDDHV_MAX
Supply Voltage VDDHV
-0.3
20
V
Pin VDDHV to GND,
High Voltage pin
VDD_IO
Input/Output Pin Voltage
-0.3
VDD +
0.3
V
Low Voltage pins to GND
VDDHV_IO
Input/Output Pin Voltage
-0.3
VDDHV
+ 0.3
V
High Voltage pins to GND
ISCR
Input Current
(latch-up immunity)
± 100
mA
JESD78D
Electrostatic Discharge
ESDHBM
Electrostatic Discharge
HBM
±1000
V
JS-001-2014
ESDCDM
Electrostatic Discharge
CDM
±500
V
JEDEC JESD22-C101F Oct 2013
Temperature Ranges and Storage Conditions
TSTRG
Storage Temperature
-40
85
°C
TBODY
Package Body
Temperature
260
°C
IPC/JEDEC J-STD-020 (1)
RHNC
Relative Humidity (non-
condensing)
5
85
%
MSL
Moisture Sensitivity Level
3
Represents a 168 hour max. floor
lifetime
Bump Temperature (soldering)
TPEAK
(1)
Peak Temperature
235
245
°C
Solder Profile
(1)
The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for no hermetic Solid State Surface Mount Devices.” The lead finish for
Pb-free leaded packages is
“Matte Tin” (100 % Sn)



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