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ams Datasheet

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[v1-04] 2020-Apr-10

TCS3472 − Pack age Drawings & Mark ings

Figure 37:

Package FN – Dual Flat No-Lead Packaging Configuration

Notes:

1. All linear dimensions are in micrometers. Dimension tolerance is ±20 μm unless otherwise noted.

2. The die is centered within the package within a tolerance of ± 3 mils.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Package Drawings & Markings

Green

RoHS