TMG49037 datasheet(71/79 Pages) OSRAM

Il numero della parte	TMG49037

Spiegazioni elettronici	Gesture, Color and Proximity Sensor Module

PDF	79 Pages

Scroll/Zoom	100%

Produttore elettronici	OSRAM [OSRAM GmbH]

Homepage	http://www.osram.com

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Page 70

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[v1-01] 2019-Aug-20

TMG49037 − Soldering and Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 76:

Solder Reflow Profile

Figure 77:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5 °C/s

Soak time

tsoak

2 to 3 minutes

Time above 217 °C (T1)

Max 60s

Time above 230 °C (T2)

Max 50s

Time above Tpeak – 10 °C (T3)

Max 10s

Peak temperature in reflow

Tpeak

260 °C

Temperature gradient in cooling

Max -5 °C/s

Soldering and Storage

Information

Not to Scale

Tpeak

Time in seconds

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