TSL2561 datasheet(31/37 Pages) OSRAM

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Page 30

ams Datasheet

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[v1-01] 2018-Apr-23

TSL2561 − Manufacturing Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package

molding compound. To ensure the package molding

compound contains the smallest amount of absorbed moisture

possible, each device is dry-baked prior to being packed for

shipping. Devices are packed in a sealed aluminized envelope

with silica gel to protect them from ambient moisture during

shipping, handling, and storage before use.

The T package have been assigned a moisture sensitivity level

of MSL 3 and the devices should be stored under the following

conditions:

• Temperature Range: 5°C to 50°C

• Relative Humidity: 60% maximum

• Total Time: 6 months from the date code on the

aluminized envelope - if unopened

• Opened Time: 168 hours or fewer

Rebaking will be required if the devices have been stored

unopened for more than 6 months or if the aluminized envelope

has been open for more than 168 hours. If rebaking is required,

it should be done at 90°C for 4 hours.

TSL2561 Scheda tecnica(PDF) 31 Page - OSRAM GmbH