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PLB16004U Scheda tecnica(PDF) 4 Page - NXP Semiconductors |
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PLB16004U Scheda tecnica(HTML) 4 Page - NXP Semiconductors |
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4 / 12 page ![]() 1997 Feb 18 4 Philips Semiconductors Product specification Microwave power transistor PLB16004U THERMAL CHARACTERISTICS Note 1. See “Mounting recommendations in the General part of handbook SC19a”. CHARACTERISTICS Tmb =25 °C unless otherwise specified. APPLICATION INFORMATION Microwave performance up to Tmb =25 °C in a common-base test circuit as shown in Fig.3. SYMBOL PARAMETER CONDITIONS MAX. UNIT Rth j-mb thermal resistance from junction to mounting base Tj = 100 °C 11 K/W Rth mb-h thermal resistance from mounting base to heatsink note 1 0.3 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICES collector cut-off current RBE = 0; VCE =30V − 200 µA V(BR)CBO collector-base breakdown voltage IC = 1 mA; IE =0 40 − V V(BR)CES collector-emitter breakdown voltage IC = 1 mA; IE =0 40 − V V(BR)EBO emitter-base breakdown voltage IC = 1 mA; IE =0 3 − V hFE DC current gain IC = 300 mA; VCE = 5 V 15 100 MODE OF OPERATION f (GHz) VCC (V) PL (W) Gp (dB) ηC (%) Zi; ZL ( Ω) Class C (CW) 1.6 28 typ. 5 typ. 10 typ. 50 see Figs 5 and 6 |
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