| Motore di ricerca datesheet componenti elettronici |
|
MPC8541E Scheda tecnica(PDF) 73 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC8541E Scheda tecnica(HTML) 73 Page - Freescale Semiconductor, Inc |
|
73 / 84 page ![]() MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 73 Thermal The spring mounting should be designed to apply the force only directly above the die. By localizing the force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the package. Figure 46 and provide exploded views of the plastic fence, heat sink, and spring clip. Figure 46. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence |
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |