MPC8540CPX667JC datasheet(12/104 Pages) FREESCALE

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MPC8540 Integrated Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Power Characteristics

The estimated power dissipation on the AVDD supplies for the MPC8540 PLLs is shown in Table 5.

Table 6 provides estimated I/O power numbers for each block: DDR, PCI, Local Bus, RapidIO, TSEC, and

FEC.

333

667

6.3

9.3

833

6.9

10.9

1000 6

11.3

15.9

Notes:

1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD.

2. Junction temperature is a function of die size, on-chip power dissipation, package thermal

resistance, mounting site (board) temperature, air flow, power dissipation of other

components on the board, and board thermal resistance. Any customer design must take

these considerations into account to ensure the maximum 105 °C junction temperature is

not exceeded on this device.

3. Typical Power is based on a nominal voltage of VDD = 1.2 V, a nominal process, a junction

temperature of Tj = 105 °C, and a Dhrystone 2.1 benchmark application.

4. Thermal solutions will likely need to design to a number higher than Typical Power based on

the end application, TA target, and I/O power.

5. Maximum power is based on a nominal voltage of VDD = 1.2 V, worst case process, a junction

temperature of Tj = 105 °C, and an artificial smoke test.

6. The nominal recommended VDD is 1.3 V for this speed grade.

Table 5. MPC8540 AVDD Power Dissipation

AVDDnTypical

Unit

AVDD10.007

AVDD20.014

Notes:

1. VDD = 1.2 V (1.3 V for 1.0 GHz device), TJ = 105°C

Table 6. Estimated Typical I/O Power Consumption

Interface

Parameter

GVDD (2.5

OVDD (3.3

LVDD (3.3

LVDD (2.5

Units

Notes

DDR I/O

CCB = 200 MHz

0.46

CCB = 266 MHz

0.59

CCB = 300 MHz

0.66

CCB = 333 MHz

0.73

Table 4. MPC8540 VDD Power Dissipation

1,2

CCB Frequency

(MHz)

Core

Frequency (MHz)

Typical Power3,4

Maximum

Power5

Unit

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