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MPXAZ4100A Scheda tecnica(PDF) 6 Page - Freescale Semiconductor, Inc

Il numero della parte MPXAZ4100A
Spiegazioni elettronici  Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal
PDF  8 Pages
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Produttore elettronici  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXAZ4100A Scheda tecnica(HTML) 6 Page - Freescale Semiconductor, Inc

  MPXAZ4100A Datasheet HTML 1Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 2Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 3Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 4Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 5Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 6Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 7Page - Freescale Semiconductor, Inc MPXAZ4100A Datasheet HTML 8Page - Freescale Semiconductor, Inc  
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Sensors
6
Freescale Semiconductor
MPXAZ4100A
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1



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