LTM2894

2

Rev A

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Supply Voltages

VBUS to GND.......................................... –0.3V to 45V

VBUS2 to GND2 ...................................... –0.3V to 45V

VLO to GND .................................................. –0.3V to 4V

VLO2 to GND2............................................... –0.3V to 4V

ON to GND ...................................... –0.3V to (VLO + 0.3)

ON2 to GND2 ................................ –0.3V to (VLO2 + 0.3)

D1+, D1– to GND ....................................... –0.3V to 5.3V

D2+, D2– to GND2 .................................... –0.3V to 5.3V

Operating Temperature Range

LTM2894C (Notes 1, 3)................................0 to 70°C

LTM2894I (Notes 1, 3).............................–40 to 85°C

LTM2894H (Notes 1, 3) ......................... –40 to 125°C

Storage Temperature Range ...................... –40 to 125°C

Maximum Internal Operating Temperature............ 125°C

Lead Temperature (Soldering, 10 sec)...................260°C

(Note 1)

X

W

V

U

T

S

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

1

2

3

4

5

6

TOP VIEW

D1– D1+ ON VLO

VBUS

GND

D2– D2+ ON2 VLO2

VBUS2

GND

GND2

GND2

BGA PACKAGE

24-LEAD (22mm × 6.25mm × 2.06mm)

TJMAX = 125°C, θJA = 49.6°C/W, θJB = 33.7°C/W, θJCTOP = 26°CW, θJCBOT = 34°C/W,

WEIGHT = 0.5g

ORDER INFORMATION

PART NUMBER

PACKAGE

TYPE

BALL FINISH

PART MARKING

MSL

RATING

TEMPERATURE RANGE

DEVICE

FINISH CODE

LTM2894CY#PBF

BGA

SAC305 (RoHS)

LTM2894Y

e1

3

0°C to 70°C

LTM2894IY#PBF

–40°C to 85°C

LTM2894HY#PBF

–40°C to 125°C

• Device temperature grade is indicated by a label on the shipping container.

• Pad or ball finish code is per IPC/JEDEC J-STD-609.

• BGA Package and Tray Drawings

• This product is not recommended for second side reflow.

This product is moisture sensitive. For more information, go to

Recommended BGA PCB Assembly and Manufacturing Procedures.