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PI3033B Scheda tecnica(PDF) 3 Page - AMI SEMICONDUCTOR |
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PI3033B Scheda tecnica(HTML) 3 Page - AMI SEMICONDUCTOR |
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3 / 13 page ![]() Preliminary PI3033B datasheet Bonding Pad Outputs Locations and Die Dimensions Figure 2 shows image sensors die dimension and the bonding pad locations for PI3033B Sensor Chip. The location is referenced to the lower left corner of the die. Note RSTLV, bias, pad is not used. Figure 2. Bonding Pad and Chip Layout: Page 3 of 13 Date: 03/18/05 |
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