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TDA8006H/C2 Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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TDA8006H/C2 Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
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3 / 40 page ![]() 2000 Feb 21 3 Philips Semiconductors Product specification Multiprotocol IC Card coupler TDA8006 QUICK REFERENCE DATA Note 1. IDD in all configurations include the current at pins VDD, VDDA and VDDRAM. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDD supply voltage 4.2 − 6V IDD(pd) supply current in power-down mode VDD = 5 V; card inactive; note 1 −− 250 µA IDD(sm) supply current in sleep mode card powered but clock stopped; note 1 −− 1500 µA VCC card supply voltage including static loads (5 V card) 4.75 5.0 5.25 V with 40 nAs dynamic loads on 100 nF capacitor (5 V card) 4.6 − 5.4 V including static loads (3 V card) 2.80 − 3.20 V with 24 nAs dynamic loads on 100 nF capacitor (3 V card) 2.75 − 3.25 V ICC card supply current operating −− 65 mA overload detection − 80 − mA SR slew rate (rise and fall) maximum load capacitor pin VCC 400 nF (including typical 100 nF decoupling) 0.10 0.16 0.22 V/ µs tde deactivation cycle duration −− 100 µs tact activation cycle duration −− 225 µs fxtal crystal frequency 4 − 25 MHz foper operating frequency external frequency applied on pin XTAL1 0 − 25 MHz Tamb operating ambient temperature −25 − +85 °C |
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