 2004 Microchip Technology Inc.

DS21460C-page 17

TC7135

28-Lead Plastic Leaded Chip Carrier (LI) – Square (PLCC)

10

5

0

10

5

0

β

Mold Draft Angle Bottom

10

5

0

10

5

0

α

Mold Draft Angle Top

0.53

0.51

0.33

.021

.020

.013

B

Lower Lead Width

0.81

0.74

0.66

.032

.029

.026

B1

Upper Lead Width

0.33

0.27

0.20

.013

.011

.008

c

Lead Thickness

7

7

n1

Pins per Side

10.92

10.67

10.41

.430

.420

.410

D2

Footprint Length

10.92

10.67

10.41

.430

.420

.410

E2

Footprint Width

11.58

11.51

11.43

.456

.453

.450

D1

Molded Package Length

11.58

11.51

11.43

.456

.453

.450

E1

Molded Package Width

12.57

12.45

12.32

.495

.490

.485

D

Overall Length

12.57

12.45

12.32

.495

.490

.485

E

Overall Width

0.25

0.13

0.00

.010

.005

.000

CH2

Corner Chamfer (others)

1.40

1.14

0.89

.055

.045

.035

CH1

Corner Chamfer 1

0.79

0.66

0.53

.031

.026

.021

A3

Side 1 Chamfer Height

0.51

.020

A1

Standoff

§

4.06

3.87

3.68

A2

Molded Package Thickness

4.57

4.39

4.19

.180

.173

.165

A

Overall Height

1.27

.050

p

Pitch

28

28

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

A2

c

E2

2

D

D1

n

#leads=n1

E

E1

1

A3

A

B1

32

°

B

p

D2

CH1 x 45

°

CH2 x 45

°

β

α

A1

.145

.153

.160

.028

.035

0.71

0.89

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-047

Drawing No. C04-026

§ Significant Characteristic