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ST7LITE49M Scheda tecnica(PDF) 186 Page - STMicroelectronics |
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ST7LITE49M Scheda tecnica(HTML) 186 Page - STMicroelectronics |
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186 / 188 page ![]() Package characteristics ST7LITE49M 186/188 15.2 Thermal characteristics Table 105. Thermal characteristics(1) 1. TBD stands for ‘to be determined’. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) LQFP32 TBD °C/W TJmax Maximum junction temperature(2) 2. The maximum chip-junction temperature is based on technology characteristics. TBD °C PDmax Power dissipation(3) 3. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. LQFP32 TBD mW |
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