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TC1313 Scheda tecnica(PDF) 21 Page - Microchip Technology

Il numero della parte TC1313
Spiegazioni elettronici  500 mA Synchronous Buck Regulator, 300 mA LDO
PDF  28 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC1313 Scheda tecnica(HTML) 21 Page - Microchip Technology

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© 2005 Microchip Technology Inc.
DS21974A-page 21
TC1313
10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
E2
D
A1
A
A3
TOP VIEW
EXPOSED
METAL
PAD
BOTTOM VIEW
21
ID INDEX
PIN 1
E
L
D2
p
b
n
AREA
(NOTE 2)
TIE BAR
(NOTE 1)
EXPOSED
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package may have one or more exposed tie bars at ends.
Overall Length
Lead Thickness
Overall Width
Exposed Pad Length
Exposed Pad Width
Lead Width
Lead Length
D
b
L
D2
E2
A3
E
Overall Height
Number of Pins
Pitch
Standoff
n
A
A1
e
Dimension Limits
Units
1.65
2.39
3.00
3.00
0.90
MILLIMETERS*
0.50 BSC
0.20 REF.
0.02
0.25
0.40
.118
.112
.008
.012
.051
.010
.016
.065
.008 REF.
.082
.112
.094
.118
.124
2.85
1.30
0.18
0.30
.015
.020
.067
2.85
2.08
.096
.124
MAX
10
.020 BSC
.031
.000
.035
.001
NOM
INCHES
MIN
0.00
0.80
.039
.002
MIN
NOM
3.15
1.70
0.30
0.50
3.15
2.45
10
1.00
0.05
MAX
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Exposed pad varies according to die attach paddle size.
Drawing No. C04-063, Revised 05-05-05
*Controlling Parameter
See ASME Y14.5M
See ASME Y14.5M
JEDEC equivalent: Not Registered
Notes:



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