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23017 Scheda tecnica(PDF) 37 Page - Microchip Technology |
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23017 Scheda tecnica(HTML) 37 Page - Microchip Technology |
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37 / 48 page ![]() © 2007 Microchip Technology Inc. DS21952B-page 37 MCP23017/MCP23S17 3.0 PACKAGING INFORMATION 3.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 28-Lead SOIC YYWWNNN Example: 28-Lead PDIP (Skinny DIP) Example: XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX 28-Lead SSOP YYWWNNN XXXXXXXXXXXX XXXXXXXXXXXX Example: 0648256 MCP23017 28-Lead QFN Example: E/SS^^3 e XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNN MCP23017-E/SP^^ 0648256 3 e 0648256 MCP23017-E/SO^^3 e XXXXXXXX XXXXXXXX YYWWNNN 23017 E/ML^^ 0648256 3 e |
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