LP2950, LP2951, NCV2951

www.onsemi.com

3

MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)

Rating

Symbol

Value

Unit

Input Voltage

VCC

30

Vdc

Peak Transient Input Voltage (t < 300 ms)

VCC

32

Vdc

Power Dissipation and Thermal Characteristics

Maximum Power Dissipation

PD

Internally Limited

W

Case 751(SOIC−8) D Suffix

Thermal Resistance, Junction−to−Ambient

RqJA

180

°C/W

Thermal Resistance, Junction−to−Case

RqJC

45

°C/W

Case 369A (DPAK) DT Suffix (Note 1)

Thermal Resistance, Junction−to−Ambient

RqJA

92

°C/W

Thermal Resistance, Junction−to−Case

RqJC

6.0

°C/W

Case 29 (TO−226AA/TO−92) Z Suffix

Thermal Resistance, Junction−to−Ambient

RqJA

160

°C/W

Thermal Resistance, Junction−to−Case

RqJC

83

°C/W

Case 626 N Suffix

Thermal Resistance, Junction−to−Ambient

RqJA

105

°C/W

Case 846A (Micro8) DM Suffix

Thermal Resistance, Junction−to−Ambient

RqJA

240

°C/W

Feedback Input Voltage

Vfb

−1.5 to +30

Vdc

Shutdown Input Voltage

Vsd

−0.3 to +30

Vdc

Error Comparator Output Voltage

Verr

−0.3 to +30

Vdc

Operating Ambient Temperature Range

TA

−40 to +125

°C

Maximum Die Junction Temperature Range

TJ

+150

°C

Storage Temperature Range

Tstg

−65 to +150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.