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TPS73201DBVR Scheda tecnica(PDF) 46 Page - Texas Instruments |
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TPS73201DBVR Scheda tecnica(HTML) 46 Page - Texas Instruments |
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46 / 49 page ![]() www.ti.com PACKAGE OUTLINE C 8X 0.37 0.25 1.75 0.1 2X 1.95 1.5 0.1 6X 0.65 1 MAX 8X 0.5 0.3 0.05 0.00 (0.65) A 3.1 2.9 B 3.1 2.9 (DIM A) TYP 4X (0.23) VSON - 1 mm max height DRB0008A PLASTIC SMALL OUTLINE - NO LEAD 4218875/A 01/2018 DIM A OPT 1 OPT 2 (0.1) (0.2) PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 4.000 |
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