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AT93C46D [DATASHEET]

Atmel-5193H-SEEPROM-AT93C46D-Datasheet_012015

8.

Ordering Information

Note:

1.

For wafer sales, please contact Atmel sales. Bumped die available upon request.

Atmel Ordering Code

Lead Finish

Package

Delivery Information

Operation

Range

Form

Quantity

AT93C46DN-SH-B

NiPdAu

(Lead-free/Halogen-free)

8S1

Bulk (Tubes)

100 per Tube

Industrial

Temperature

(-40

C to 85C)

AT93C46DN-SH-T

Tape and Reel

4,000 per Reel

AT93C46D-TH-B

8X

Bulk (Tubes)

100 per Tube

AT93C46D-TH-T

Tape and Reel

5,000 per Reel

AT93C46DY6-YH-T

8MA2

Tape and Reel

5,000 per Reel

AT93C46DY6-YH-E

Tape and Reel

15,000 per Reel

AT93C46D-PU

Matte Tin

(Lead-free/Halogen free)

8P3

Bulk (Tubes)

50 per Tube

AT93C46DU3-UU-T

SnAgCu

(Lead-free/Halogen-free)

8U3-1

Tape and Reel

5,000 per Reel

AT93C46D-W-11(1)

N/A

Wafer Sale

Note 1

Package Type

8S1

8-lead, 0.150” wide, Plastic Gull Wing, Small Outline (JEDEC SOIC)

8X

8-lead, 0.170” wide, Thin Shrink Small Outline (TSSOP)

8MA2

8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Ultra Thin Dual No Lead (UDFN)

8P3

8-lead, 0.300” wide body, Plastic Dual In-line Package (PDIP)

8U3-1

8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Small Die Ball Grid Array (VFBGA)