SM5S10CA thru SM5S85CA

www.vishay.com

Vishay General Semiconductor

Revision: 03-Mar-2023

4

Document Number: 98458

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Fig. 7 - Typical Transient Thermal Impedance

Note

• Fig.1 - Power calculation is based on IPPM times defined maximum clamping voltage by pulse width

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

10

100

1000

10000

0.01

0.1

1

10

100

1000

0.001

0.01

0.1

1

10

100

1000

t

p - Pulse Duration (s)

R JA

R JM

DO-218AB

Mounting Pad Layout

0.413 (10.5)

0.374 (9.5)

0.091 (2.3)

0.067 (1.7)

0.116 (3.0)

0.093 (2.4)

0.150 (3.8)

0.126 (3.2)

0.366 (9.3)

0.343 (8.7)

0.606 (15.4)

0.583 (14.8)

0.116 (3.0)

0.093 (2.4)

0.628 (16.0)

0.592 (15.0)

0.539 (13.7)

0.524 (13.3)

0.366 (9.3)

0.343 (8.7)

0.406 (10.3)

0.382 (9.7)

0.342 (8.7)

0.327 (8.3)

0.413 (10.5)

0.374 (9.5)

0.028 (0.7)

0.020 (0.5)

0.138 (3.5)

0.098 (2.5)

Lead 1

0.098 (2.5)

0.059 (1.5)

Lead 2/Metal Heatsink

0.197 (5.0)

0.185 (4.7)

0.016 (0.4) MIN.