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MCP8021 Scheda tecnica(PDF) 54 Page - Microchip Technology

Il numero della parte MCP8021
Spiegazioni elettronici  3-Phase Brushless DC (BLDC) Motor Gate Driver with Power Module, Sleep Mode, Op Amps
PDF  66 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP8021 Scheda tecnica(HTML) 54 Page - Microchip Technology

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MCP8021/2
DS20006265D-page 54
 2020-2024 Microchip Technology Inc. and its subsidiaries
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
4.70
3.20
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
1.50
0.45
NOM
C
Contact Pad Spacing
5.90
Contact Pad to Contact Pad (X26)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad (X28)
G1
0.60
Microchip Technology Drawing C04-2521 Rev A
28-Lead Shrink Smal Outline Package (KEX) - 4.4 mm (.300 In.) Body [TSSOP]
With 3.1x4.6 mm Exposed Pad
C
EV
EV
Y2
X2
X1
Y1
G2
E
SILK SCREEN
G1
ØV



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