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EMIF06-MSD01F2 Scheda tecnica(PDF) 5 Page - STMicroelectronics |
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EMIF06-MSD01F2 Scheda tecnica(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() EMIF06-mSD01F2 Ordering information scheme 5/7 3 Ordering information scheme 4 Package information Figure 9. Flip-Chip Package dimensions EMIF yy - xxx zz Fx EMI Filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version F = Flip-Chip x = 2: Lead free Pitch = 500 µm, Bump = 315 µm Figure 10. Foot print recommendations Figure 11. Marking 1.92 mm ± 50 µm 315 µm ± 50 500 µm ± 50 650 µm ± 65 Copper pad Diameter: 250 µm recommended , 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter x y z w x w Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location E |
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