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PACKAGE OUTLINE

C

0.9

0.8

0.05

0.00

5.5

TYP

5.5 TYP

0.5

TYP

0.5 TYP

80X

0.3

0.2

2.8 0.1

B

6.1

5.9

A

6.1

5.9

(0.725)

(0.725)

(0.125)

(0.125)

4224877/A 03/2019

TLGA - 0.9 mm max height

NPP0080A

THIN LAND GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

CORNER

PIN A1

SEATING PLANE

0.08 C

A

1

2

3

0.1

C A B

0.05

C

4

5

6

7

8

9

10

11

12

SYMM

SYMM

B

C

D

E

F

G

H

J

K

L

M

PIN 1 ID

(45 X 0.35)

SCALE 2.500