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SN74AS30D Scheda tecnica(PDF) 2 Page - Texas Instruments

Il numero della parte SN74AS30D
Spiegazioni elettronici  8-INPUT POSITIVE-NAND GATES
PDF  19 Pages
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Produttore elettronici  TI [Texas Instruments]
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SN74AS30D Scheda tecnica(HTML) 2 Page - Texas Instruments

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SN54ALS30A, SN54AS30, SN74ALS30A, SN74AS30
8-INPUT POSITIVE-NAND GATES
SDAS010C – MARCH 1984 – REVISED NOVEMBER 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
A–H
OUTPUT
Y
All inputs H
L
One or more inputs L
H
logic symbol
Y
8
1
A
2
B
3
C
4
D
5
E
6
F
11
G
12
H
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, J, and N packages.
logic diagram (positive logic)
Y
8
1
A
2
B
3
C
4
D
5
E
6
F
11
G
12
H
Pin numbers shown are for the D, DB, J, and N packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI
–0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 1): D package
86
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package
96
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package
80
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.



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