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POP Scheda tecnica(PDF) 4 Page - Amkor Technology

Il numero della parte POP
Spiegazioni elettronici  Bottom PoP Technologies
PDF  4 Pages
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Produttore elettronici  AMKOR [Amkor Technology]
Homepage  http://www.amkor.com
Logo AMKOR - Amkor Technology

POP Scheda tecnica(HTML) 4 Page - Amkor Technology

  POP Datasheet HTML 1Page - Amkor Technology POP Datasheet HTML 2Page - Amkor Technology POP Datasheet HTML 3Page - Amkor Technology POP Datasheet HTML 4Page - Amkor Technology  
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With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such
information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not
in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor
reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are
registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.
© 2019 Amkor Technology, Incorporated. All Rights Reserved. TS114A-EN Rev Date: 02/19
Visit amkor.com or email sales@amkor.com for more information.
Cross Section TMV® PoP
A
B
C
D
E
Body Size
(mm)
Package Interconnect - 2 Rows
Bottom Package
0.4 mm Pitch
(Full Matrix)
Max Die Size
Flip Chip
(mm)
Package Interconnect
Ball Center To Package
Edge (mm)
Matrix
Top Ball Count
10
23
168
529
7.00
6.00
11
26
192
676
8.00
7.00
12
18
128
400
< 7.50
0.475
13
19
136
450
< 8.00
0.650
TMV® Design Table For 0.4 mm Pitch 2 Row Stacked Interfaces
Cross Section TMV® PoP
Cross Section PSfcCSP
A
B
C
Body Size
(mm)
Package Interconnect
Die Size
(mm)
Matrix
Ball Count
10
19
136
< 6.00
11
21
152
< 7.00
12
23
168
< 8.00
13
25
184
< 9.00
14
27
200
< 9.50
15
29
216
< 10.00
PSfcCSP Design Table For 0.5 mm Pitch 2 Row
Stacked Interfaces
0.25-0.40 mm
A
D
B
C
TMV® Overall Stack Up Table (mm)
Symbol
Min
Max
Nom
A1 (Mounted, 0.4 pitch)
0.100
0.200
0.150
A2 (4L Laminate)
0.220
0.300
0.260
A3 (Mold Cap)
0.230
0.280
0.250
B1 (Stacked Gap)
0.020
0.080
0.050
B2 (2L Laminate)
0.100
0.160
0.130
B3 (Mold Cap)
0.370
0.430
0.400
Overall Package Height
1.140
1.340
1.240
A1
A2
A3
B1
B2
B3
C
B
A
B3
A1
B1
A3
A2
B2



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