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PowerCSP™

Heat spreader attach (optional)

Wettable flank (optional)

High thermal and electrical conductive materials

(solder, hybrid or sintered materials)

Conventional QFN process flow

is possible to apply

HS side wall is possible

to cover by EMC

The first implementation of PowerCSP™ technology shows its flexibility and many construction options.

The PowerCSP™ design provides many connectivity options for chip scale power.

Packaging variations for chip scale power based on the flexibility of the PowerCSP™ design.

Example of embedded technology.

Gate on PCB

Internal Gate

Exposed back drain

Covered back drain