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TLE2072ACD Scheda tecnica(PDF) 3 Page - Texas Instruments |
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TLE2072ACD Scheda tecnica(HTML) 3 Page - Texas Instruments |
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3 / 37 page ![]() TLE2072, TLE2072A, TLE2072Y EXCALIBUR LOW-NOISE HIGH-SPEED JFET-INPUT DUAL OPERATIONAL AMPLIFIERS SLOS124A – JUNE 1993 – REVISED AUGUST 1994 5–3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2072Y chip information This chip, when properly assembled, displays characteristics similar to the TLE2072. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF THE CHIP. + – 1OUT 1IN + 1IN – VCC+ (4) (6) (3) (2) (5) (1) (7) (8) – + 2OUT 2IN + 2IN – VCC – 80 90 (1) (2) (3) (4) (5) (6) (7) (8) |
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