TMX HT05

SAW Bandpass Filters | Wireless Communications

Issue: Rev 2, 10 January 2023

Specifications are subject to change without notice

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Recommended Reflow Soldering Profile

NOTE:

•

The components shall remain within the electrical specifications after it soldered on the 1mm thickness PCB board and dipped

in the solder at 260 ± 5°C during 10 ± 1 seconds.

•

The components shall remain within the electrical specifications after it soldered by electric iron, solder at 350 ± 10 °C during

3~4 seconds. Recovery time: 2 ± 0.5 hour.

•

Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning.

•

Only leads of components may be soldered. Please avoid soldering another part of the component.