TSL2563CS datasheet(34/38 Pages) TAOS

Il numero della parte	TSL2563CS

Spiegazioni elettronici	LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER

PDF	38 Pages

Scroll/Zoom	100%

Produttore elettronici	TAOS [TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS]

Homepage	http://www.taosinc.com

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34 / 38 page

TSL2562, TSL2563

LOW-VOLTAGE

LIGHT-TO-DIGITAL CONVERTER

TAOS066J − MAY 2007

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

The CS and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB

substrate. The process, equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat exposure of components during the solder

reflow process of product on a PCB. Temperature is measured on top of component. The components should

be limited to a maximum of three passes through this solder reflow profile.

Table 13. TSL2562/63 Solder Reflow Profile

PARAMETER

REFERENCE

TSL2562/63

Average temperature gradient in preheating

2.5°C/sec

Soak time

tsoak

2 to 3 minutes

Time above 217°C

Max 60 sec

Time above 230°C

Max 50 sec

Time above Tpeak −10°C

Max 10 sec

Peak temperature in reflow

Tpeak

260° C (−0°C/+5°C)

Temperature gradient in cooling

Max −5°C/sec

tsoak

Tpeak

Not to scale — for reference only

Time (sec)

Figure 23. TSL2562/TSL2563 Solder Reflow Profile Graph

TSL2563CS Scheda tecnica(PDF) 34 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS