STVM100 datasheet(23/27 Pages) STMICROELECTRONICS

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STVM100

Package mechanical

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Package mechanical

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 21.

MLPD-DFN 3 x 3 x.75mm, pitch 0.65, package mechanical data

Drawing is not to scale.

Table 9.

MLPD-DFN 3 x 3 x .75mm, pitch 0.65, package mechanical data

Sym

inches

Typ

Min

Max

Typ

Min

Max

0.75

0.70

0.80

0.0295

0.0276

0.0315

0.02

0.00

0.05

0.0008

0.0000

0.0020

0.20

0.0079

0.30

0.25

0.35

0.0118

0.0098

0.0138

3.00

0.1181

2.38

2.23

2.48

0.0937

0.0878

0.0976

3.00

0.1181

1.64

1.49

1.74

0.0646

0.0587

0.0685

e0.65–

–

0.0256

–

0.40

0.30

0.50

0.0157

0.0118

0.0197

0.08

EZ_ME

A3 A1

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