M93C66-RBN3TGSLASHS datasheet(33/38 Pages) STMICROELECTRONICS

33 / 38 page

M93C86, M93C76, M93C66, M93C56, M93C46

Part numbering

33/38

Part numbering

For a list of available options (speed, package, etc.) or for further information on any aspect

of this device, please contact your nearest ST sales office.

The category of second-level interconnect is marked on the package and on the inner box

label, in compliance with JEDEC Standard JESD97. The maximum ratings related to

soldering conditions are also marked on the inner box label.

Table 28.

Ordering information scheme

Example:

M93C86

–

W MN 6

P /S

Device type

M93 = MICROWIRE serial access EEPROM

Device function

86 = 16 Kbit (2048 x 8)

76 = 8 Kbit (1024 x 8)

66 = 4 Kbit (512 x 8)

56 = 2 Kbit (256 x 8)

46 = 1 Kbit (128 x 8)

Operating voltage

blank = VCC = 4.5 to 5.5 V

W = VCC = 2.5 to 5.5 V

R = VCC = 1.8 to 5.5 V

Package

BN = PDIP8

MN = SO8 (150 mils width)

MB = UFDFPN8 (MLP8)

DW = TSSOP8 (169 mils width)

DS = TSSOP8 (3 x 3 mm body size)

Device grade

6 = Industrial temperature range, –40 to 85 °C.

Device tested with standard test flow

3 = Device tested with High Reliability Certified Flow(1).

Automotive temperature range (–40 to 125 °C)

ST strongly recommends the use of the Automotive Grade devices for use in an automotive

environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801.

Please ask your nearest ST sales office for a copy.

Packing

blank = standard packing

T = tape and reel packing

Plating technology

P or G = ECOPACK® (RoHS compliant)

Process(2)

Used only for Device Grade 3.

/W or /S = F6SP36%

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