TLC6989 datasheet(59/72 Pages) TI1

Il numero della parte	TLC6989

Spiegazioni elettronici	TLC6989 SPI-Compatible Connectivity for TLC698x Device Family

PDF	72 Pages

Scroll/Zoom	100%

Produttore elettronici	TI1 [Texas Instruments]

Homepage	http://www.ti.com

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59 / 72 page

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EXAMPLE BOARD LAYOUT

10X (0.5)

(1)

(R0.05) TYP

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

12X (0.62)

12X (0.25)

(2.78)

(2.5)

(1.3)

( 0.2) TYP

VIA

WSON - 0.8 mm max height

DRR0012G

PLASTIC SMALL OUTLINE - NO LEAD

4227052/A 08/2021

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

SEE SOLDER MASK

DETAIL

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS

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TLC6989

SLVSHF5 – NOVEMBER 2024

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