King Billion Electronics Co., Ltd

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HE83005

HE80000 SERIES

July 28, 2003

23

V3.4

This specification is subject to change without notice. Please contact sales person for the latest version before use.

16. Important Note

1.

Please note the ICE is a superset of HE80000 series IC. Each member of the family only has parts of

all resources. Do not use any hardware resource that your target chip doesn’t have, for example,

RAM and register. KBIDS and compiler can’t prevent user from using some hardware resources that

don’t exist in your target chip.

2.

Please bond the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and

probed) as you can, then some testing can be performed on PCB when it’s necessary. The TSTP_P is

suggested to connect to ground by a 0 ohm resistor.

3.

Users should turn off the PWM and DAC function by firmware before the system enters into the

sleep and idle modes. Otherwise, there are some current leakages in the PWM/DAC circuit, and the

current will be large in the sleep and idle mode.

17. Updated History

Version

Date

New Content

V3.3

12/17/01 Change the operation voltage from 2.2V to 2.4V.

V3.4

07/28/03

Modify the datasheet format and add the bonding pad diagram and coordination for

each version.